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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Draft standard [Withdrawn]

DIN EN 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/1231/CD:2014)

Title (German)

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten (IEC 91/1231/CD:2014)

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Edition 2015-05

Original language German , English

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Table of contents

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/1231/CD:2014)

Responsible national committee

Daniel Failer

DIN EN 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/1231/CD:2014)