Projekt
IEC 62047-17 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Beginn
2013-01-11
Geplante Dokumentnummer
IEC 47F/146/CD
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
