Projekt
Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull)
Beginn
2008-08-29
Geplante Dokumentnummer
IEC 91/805/NP
Zuständiges nationales Arbeitsgremium
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
