Project
Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 3: Nano-scale wafer surface inspection method using UV light
Abstract
This part of IEC 63567-3 provides guidance on the use of optical inspection for detecting nano-scale defects on commercially available wafers using ultraviolet (UV) light. Additionally, this document describes wafer defects detected by UV inspection techniques and various other surface characterization methods.
Begin
2025-10-16
Planned document number
DIN EN IEC 63567-3
Project number
02233443
