Information technology - Telecommunications bonding networks for buildings and other structures ISO/IEC JTC1-SC 25/3153/CD:2023
Abstract
Amendment 2 to ISO/IEC 30129:2015 This International Standard specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information or telecommunications technology equipment is intended to be installed in order to a) minimise the d.c. and a.c. potential differences in order to reduce the risk of malfunction of that equipment and interconnecting cabling due to electromagnetic disturbance, b) provide the telecommunications installation with a reliable signal reference – which may improve immunity from electromagnetic interference (EMI).
Begin
2023-07-25
Planned document number
DIN ISO/IEC 30129/A2
Project number
02231740
