• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of IEC/TC 91

IEC 91/1083/CD 2013-01-25 IEC 62326-18 Ed.1: Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods More  Comment 
IEC 91/1047/CD 2012-08-24 IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More  Comment 
IEC 91/1049/CD 2012-08-24 IEC 62326-15: Printed boards - Part 15: Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages More  Comment 
IEC 91/1029/CDV 2012-03-09 IEC 62739-1 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing More  Comment 
IEC 93/316/CD 2011-09-30 IEC 62699 Ed 1.0: Mapping rules and exchanges methods for hetrogeneous parts libraries More  Comment 
IEC 91/1007/CD 2011-09-16 IEC 62326-20 Ed.1: Electronic circuit board for high-brightness LEDs More  Comment 
IEC 91/994/CD 2011-09-02 IEC 60068-3-13: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering More  Comment 
IEC 91/1000/NP 2011-09-02 Future 61189-2-629: Test method of adhasion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application More  Comment 
IEC 91/1003/CD 2011-09-02 IEC 61189-3-913 Ed.1: Test methods for electronic circuit board for high-brightness LEDs More  Comment 
IEC 91/996/NP 2011-09-02 Future IEC 62326-16: Printed boards-Device Embedded Substrate-Scope and Definition More  Comment