• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

IEC 91/919/NP 2010-02-26 Electrical test method for device embedded substrate - general electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages. More  Comment 
IEC 91/913/DC 2010-01-22 Call for comments on Actions from meeting in Berlin October 8&9, 2009 regarding both 91/887/INF and 91/888/INF More  Comment 
IEC 91/946/CDV 2010-01-08 IEC 61249-2-27 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified withnon-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad More  Comment 
IEC 91/902A/NP 2009-11-20 Future IEC 61189-12: Test methods for electrical materials, interconnection structures and assemblies, Part-12 Erosion test method on the materials of solder bath or parts which contact with molten lead free solder. More  Comment 
IEC 91/894A/NP 2009-10-23 Future IEC 62326-14: Printed boards - Device Embedded Substrate - Terminology / Reliability / Design Guide More  Comment 
IEC 91/947/CDV 2009-10-09 IEC 61249-2-30 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad More  Comment 
IEC 91/948/CDV 2009-10-09 IEC 61249-2-39 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - Modified epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More  Comment 
IEC 91/949/CDV 2009-10-02 IEC 61249-2-40 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High Performance, modified, non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More  Comment 
IEC 91/882/DC 2009-08-21 Request to SMB to establish an information/opinion exchange platform within IEC for IEC Technical Committees More  Comment 
IEC 107/107/NP 2009-07-31 Aerospace and military electronic systems containing lead-free solder - Part 1: Lead-free management (IEC/PAS 62647-1) More  Comment 

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