• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

Document number Begin Title Comment
IEC 91/393/CD 2001-10-26 IEC 61249-6-3, Ed.1: Materials for interconnection structures - Part 6-3: Sectional specification for reinforcements - Woven fibreglass fabrics More  Comment 
IEC 91/247/CDV 2001-06-29 IEC 61249-4-1 Ed.1: Materials for printed boards and other interconnecting structures - Part 4: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Section 1: Epoxide woven E-glass prepreg of defined flam More  Comment 
IEC 91/245/NP 2001-06-22 Printed wiring boards - Part XX: Guide to the rework of unassembled boards More  Comment 
IEC 91/246/NP 2001-06-22 Printed wiring boards - Part XX: Guide to the rework and repair of soldered surface mounted printed board assemblies More  Comment 
IEC 91/240/NP 2001-03-30 Test Method for Halogen-free Copper-Clad Laminates More  Comment 
IEC 91/445/CDV 2001-02-23 IEC 62326-3, Ed.1: Printed boards - Part 3: Safety certification of rigid printed circuit boards for use in electronic assemblies (performance for capability approval) More  Comment 
IEC 91/194/DC 2000-08-04 Maintenance draft: IEC 60140 More  Comment 
IEC 91/197/CD 1999-10-15 IEC 62218, Ed.1: Test 5E02: Surface insulation resistance, assemblies More  Comment 
IEC 52/807/NP 1999-04-23 Proposal of the US NC: IEC 61249-1: Materials for interconnecting structures - Part 1: Generic Specification More  Comment 
IEC 52/756/NP 1997-11-14 Proposal of the USNC: Generic computer aided manufacturing format (GenCAM) More  Comment 

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