• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 682

IEC 91/691/NP 2007-06-15 Proposal from Chinese NC: Future IEC 61249-2-41: Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More  Comment 
IEC 91/692/NP 2007-06-15 Proposal from Chinese NC: Future IEC 61249-2-42: Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass resinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More  Comment 
IEC 107/67/NP 2007-02-16 Aerospace Qualified Electronic Component (AQEC) - Part 1: Microcircuits More  Comment 
IEC 40/1817/CDV 2006-12-22 IEC 60286-3-VI: Packaging of components for automatic handling - Part 3: Type VI: Packaging of surface mount components on blister carrier tapes 4 mm in width More  Comment 
IEC 40/1785/CDV 2006-09-22 IEC 60286-3-V: Packaging of components for automatic handling - Part 3, Type V : Packaging of surface mount components on continuous pressed carrier tapes More  Comment 
IEC 91/616/NP 2006-07-21 Proposal of the JPNC: NP-PAS - Copper-Clad Laminate for Flexible Printed Wiring Boards (Adhesive and Non-adhesive types) More  Comment 
IEC 91/615/NP 2006-07-21 Proposal of the JPNC: NP-PAS - Performance guide for single- and double-sided flexible printed wiring boards More  Comment 
IEC 91/642/CDV 2006-07-14 IEC 62468 Ed.1 : The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment More  Comment 
IEC 91/663/CDV 2006-04-28 NP-CDV: IEC 61249-4-14, Ed. 1: Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly More  Comment 
IEC 107/54/NP 2006-04-28 Process management for avionics - Guide for defining and performing highly accelerated tests in avionic systems (IEC/PAS) More  Comment 

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