|
IEC 47D/576/NP
|
2004-01-30
|
Proposed IEC 60191-6-xx: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA
More
|
Comment
|
|
IEC 47D/539/NP
|
2003-04-11
|
Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch
More
|
Comment
|
|
IEC 47D/540/NP
|
2003-04-11
|
Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts
More
|
Comment
|
|
IEC 47D/542/NP
|
2003-04-11
|
Proposed new package outline, Plastic small outline family, 1,27 mm pitch, 3,9 mm body width, 8, 14 and 16 leads
More
|
Comment
|
|
IEC 47D/543/NP
|
2003-04-11
|
Proposed new package outline, Plastic small outline family, 25 mil pitch, 150 mil body width, 14, 16, 18, 20, 24 and 28 leads
More
|
Comment
|
|
IEC 47D/523/NP
|
2002-11-22
|
Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads). If approved, to be included in IEC 60191-2 serie
More
|
Comment
|
|
IEC 47D/589/FDIS
|
2002-04-12
|
IEC 60191-2, F56, Ed.1: (will become IEC 60191-2/A11/Ed.1): Proposed new package outline, 5-leaded Power SMD (Outline 176E-a)
More
|
Comment
|
|
IEC 47D/503/NP
|
2002-04-12
|
Proposed new package outline, 3/4-land SMD (If approved, to be included in IEC 60191-2)
More
|
Comment
|
|
IEC 47D/435/FDIS
|
2001-05-11
|
IEC 60191-2, F41, Ed.1: Proposal for a supplement of QFN outline drawings to the outline family of 102E
More
|
Comment
|
|
IEC 47D/533/CD
|
2001-02-23
|
IEC 60191-6-9, Ed.2: Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawing of surface mounted semiconductor device packages Design Guideline for Plastic Quad Flat Package (P-QFP)
More
|
Comment
|
