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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 631

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Document number	Begin	Title	Comment
IEC 47A/845/DC	2010-04-30	Proposed corrigendum to IEC 61967-6 Ed1.1 Consol. with am1: Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method More	Comment
IEC 47A/842/DC	2010-03-12	Proposed a new convenor of WG 2 (Logic digital integratedcircuits) of IEC SC 47A More	Comment
IEC 47F/46/NP	2010-02-26	(Future IEC 62047-17): Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films More	Comment
IEC 47F/47/NP	2010-02-26	(Future IEC 62047-18): Semiconductor devices - Micro-electromechanical devices - Part 18: Micro electro mechanical devises - Bending test methods of thin film materials More	Comment
IEC 47F/70/CDV	2009-10-30	IEC 62047-14 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials More	Comment
IEC 47F/38/NP	2009-10-30	(Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip More	Comment
IEC 47F/39/NP	2009-10-30	(Future IEC 62047-16): Semiconductor devices -Micro-electromechanical devices - Part 16: Test method forresidual stress measurement More	Comment
IEC 47/2082/FDIS	2009-09-04	IEC 60749-21 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More	Comment
IEC 47/2083/FDIS	2009-09-04	IEC 60749-29 Ed.2: SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 29: Latch-up test More	Comment
IEC 47A/840/DTS	2009-08-07	IEC/TS 62433-1 Ed.1: EMC IC Modelling, Part 1: General modelling framework More	Comment

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