Projects of DKE/K 631

Document number Begin Title Comment
DIN EN IEC 63608-2 2025-06-25 Reliability evaluation methods for vibration energy harvesters - Part 2: Temperature and humidity More  Comment 
DIN IEC 63364-2 2025-06-25 Semiconductor devices - semiconductor devices for IOT system - Part 2: test method of semiconductor photon sources incorporating human factors for wearable equipment More  Comment 
DIN EN IEC 63551-5 2025-01-08 Semiconductor devices - Detection modules of autonomous land vehicle - Part 5: Testing methods of performance for ultrasonic modules More  Comment 
DIN EN IEC 63551-6 2025-01-08 Semiconductor devices - Detection modules of autonomous land vehicle - Part 6: Testing methods of performance for visual imaging modules More  Comment 
DIN EN IEC 61967-1 2024-12-18 Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions More  Comment 
DIN EN IEC 62132-1 2024-12-18 Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions More  Comment 
DIN EN IEC 60749-22-1 2024-11-04 Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods More  Comment 
DIN EN IEC 60749-22-2 2024-11-04 Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods More  Comment 
DIN EN IEC 62228-5 2024-10-15 Integrated circuits - EMC evaluation of transceivers - Part 5: Ethernet transceivers More  Comment 
DIN EN IEC 62228-3 2024-10-15 Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers More  Comment 

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