Projects of NA 022

DIN EN IEC 63378-2-2 2024-09-05 3D thermal simulation models of PBGA and FBGA packages for steady-state analysis More  Comment 
DIN EN IEC 63378-4 2024-09-05 Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages More  Comment 
DIN EN IEC 60204-1 2024-09-05 Safety of machinery - Electrical equipment of machines - Part 1: General requirements More  Comment 
DIN EN IEC 63563-3 2024-09-04 Qi Specification version 2.0 - Part 3: Mechanical, Thermal, and User Interface More  Comment 
DIN EN IEC 63563-4 2024-09-04 Qi Specification version 2.0 - Part 4: Power Delivery (IEC 63563-4:2025); English version EN IEC 63563-4:2025 More  Comment 
DIN EN IEC 63563-5 2024-09-04 Qi Specification version 2.0 - Part 5: Communications Physical Layer More  Comment 
DIN EN IEC 63563-7 2024-09-04 Qi Specification version 2.0 - Part 7: Foreign Object Detection More  Comment 
DIN EN IEC 63563-8 2024-09-04 Qi Specification version 2.0 - Part 8: NFC Tag Protection More  Comment 
DIN EN IEC 63563-9 2024-09-04 Qi Specification version 2.0 - Part 9: Authentication Protocol More  Comment 
DIN EN IEC 63563-6 2024-09-04 Qi Specification version 2.0 - Part 6: Communications Protocol (IEC 63563-6:2025); English version EN IEC 63563-6:2025 More  Comment 

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