• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Publications of DKE/K 682

DIN EN IEC 60068-2-82 ; VDE 0468-2-82:2020-11 2020-11 Standards Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies (IEC 60068-2-82:2019); German version EN IEC 60068-2-82:2019 More  Order from DIN Media
DIN EN IEC 60068-2-83 ; VDE 0468-2-83:2025-06 2025-06 Draft standard Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 91/1968/CDV:2024); German and English version prEN IEC 60068-2-83:2024 More  Order from DIN Media
DIN EN IEC 60068-2-88 ; VDE 0468-2-88:2025-06 2025-06 Draft standard Environmental testing - Part 2-88: Tests - Test XD: Resistance of components and assemblies to liquid cleaning media (IEC 91/1964/CDV:2024); German and English version prEN IEC 60068-2-88:2024 More  Order from DIN Media
DIN EN IEC 60286-2 2023-11 Standards Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes (IEC 60286-2:2022); German version EN IEC 60286-2:2022 More  Order from DIN Media
DIN EN IEC 60286-3 2023-11 Standards Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2022); German version EN IEC 60286-3:2022 More  Order from DIN Media
DIN EN IEC 60286-5 2019-04 Standards Packaging of components for automatic handling - Part 5: Matrix trays (IEC 60286-5:2018); German version EN IEC 60286-5:2018 More  Order from DIN Media
DIN EN IEC 61188-6-1 2022-08 Standards Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021 More  Order from DIN Media
DIN EN IEC 61188-6-2 2023-03 Standards Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021 More  Order from DIN Media
DIN EN IEC 61188-6-3 2022-04 Draft standard Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English More  Order from DIN Media
DIN EN IEC 61188-6-4 2020-04 Standards Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019 More  Order from DIN Media

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