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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Publications of DKE/UK 631.4

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DIN EN 60191-6-22	2013-08	Standards	Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013 More	Order from DIN Media
DIN EN IEC 60191-1	2018-10	Standards	Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018 More	Order from DIN Media
DIN EN IEC 63378-3	2026-08	Draft standard	Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis (IEC 63378-3:2025); German version EN IEC 63378-3:2025 More	Read draft and comment

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