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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Publications of NA 022

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DIN EN 62047-13	2012-10	Standards	Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012 More	Order from DIN Media
DIN EN 62047-14	2012-10	Standards	Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012 More	Order from DIN Media
DIN EN 62047-16	2015-12	Standards	Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015 More	Order from DIN Media
DIN EN 62047-17	2015-12	Standards	Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015 More	Order from DIN Media
DIN EN 62047-18	2014-04	Standards	Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013 More	Order from DIN Media
DIN EN 62047-19	2014-04	Standards	Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013 More	Order from DIN Media
DIN EN 62047-20	2015-04	Standards	Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014 More	Order from DIN Media
DIN EN 62047-21	2015-04	Standards	Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014 More	Order from DIN Media
DIN EN 62047-22	2015-04	Standards	Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014 More	Order from DIN Media
DIN EN 62047-25	2017-04	Standards	Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016 More	Order from DIN Media

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