Attention: Your browser doesn't support javascript or you have deactivated Javascript in your browser. Please enable Javascript in your browser in order to be able to use all functions of this website.

Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information

Publications of NA 022

Sort by:

				Order from DIN Media
DIN EN 62047-3	2007-02	Standards	Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006 More	Order from DIN Media
DIN EN 62047-4	2011-03	Standards	Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010 More	Order from DIN Media
DIN EN 62047-5	2012-03	Standards	Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011 More	Order from DIN Media
DIN EN 62047-6	2010-07	Standards	Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010 More	Order from DIN Media
DIN EN 62047-7	2012-02	Standards	Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011 More	Order from DIN Media
DIN EN 62047-8	2011-12	Standards	Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011 More	Order from DIN Media
DIN EN 62047-9	2012-03	Standards	Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011 More	Order from DIN Media
DIN EN 62047-10	2012-03	Standards	Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011 More	Order from DIN Media
DIN EN 62047-11	2014-04	Standards	Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013 More	Order from DIN Media
DIN EN 62047-12	2012-06	Standards	Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011 More	Order from DIN Media

454 / 500

TOP

Want to learn more?

Show

Preferred form of address

Male

Female

Neutral

First name*

Last name*

E-mail*

Phone no.

Subject

Message subject

Message*

Security code*

Here you can find our privacy policy

*Required field