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Publications of NA 022

DIN EN 60749-6 2017-11 Standards Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017 More  Order from DIN Media
DIN EN 60749-7 2012-02 Standards Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 60749-7:2011); German version EN 60749-7:2011 More  Order from DIN Media
DIN EN 60749-8 2003-12 Standards Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003 More  Order from DIN Media
DIN EN 60749-9 2017-11 Standards Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017); German version EN 60749-9:2017 More  Order from DIN Media
DIN EN 60749-11 2003-04 Standards Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method (IEC 60749-11:2002); German version EN 60749-11:2002 More  Order from DIN Media
DIN EN 60749-14 2004-07 Standards Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003 More  Order from DIN Media
DIN EN 60749-16 2003-09 Standards Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003 More  Order from DIN Media
DIN EN 60749-19 2011-01 Standards Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 More  Order from DIN Media
DIN EN 60749-20-1 2009-10 Standards Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009 More  Order from DIN Media
DIN EN 60749-21 2012-01 Standards Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011 More  Order from DIN Media

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