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IEC 2/1577/DC
Standardization of brushless permanent magnet motors
IEC 34/129/DC
Cap/Holder fit standardization
IEC 35/1091/NP
Proposal of the Danish NC: Standardization of hearing aid batteries - Proposal for a new part to the 60086 series
IEC 47D/107/FDIS
IEC 191-5: Mechanical standardization of semiconductor devices - Part 5: Recommendations applaying to integrated circuit packages using tape automated bonding (TAB)
IEC 47D/782/NP
(Future IEC 60191-6-22 Ed.1): Mechanical Standardization of Semiconductor Devices - Part 6-22: General rules for thepreparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
IEC 48B/738/NP
Proposal of the Norwegian NC: Standardization of design of connecting hardware, 4 and 8 way shielded for cable-to-cable and cable-to-board arrangements, for use in analogue and digital high speed applications, Class F, with minimum bandwidth 600 MHz
IEC 49/428/NP
Proposal of the Japanese NC: SAW materiels standardization
IEC 62A/652/CD
IEC 60513 Ed.3: Standardization of medical electrical equipment safety
IEC 86/374/DC
Proposed DTR 62658 Ed. 1.0: Standardization roadmap of optical circuit boards and related packaging technologies
IEC 100/1799/RR
Review report on IEC TR 61998: Model and framework for standardization in multimedia equipment and systems
