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DIN EN 63011-1
Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions (IEC 47A/996/CD:2016)
LN 9407-2
Basic material for printed wiring; laminated copper clad sheets, technical specification - Inactive for new design
DIN EN 63011-3
Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via (IEC 47A/997/CD:2016)
LN 9407-1
Basic material for printed wiring; laminated copper clad sheets, dimensions, weigths; Inactive for new design
DIN EN IEC 60749-29
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
FprEN ISO 8100-2
Lifts for the transport of persons and goods - Part 2: Design rules, calculations, verifications and tests of lift components (ISO/FDIS 8100-2:2025)
IEC 47/2155/CDV
IEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM)
DIN EN IEC 61558-2-8
Safety of transformers, reactors, power supply units and combinations thereof - Part 2-8: Particular requirements and tests for transformers and power supply units for bells and chimes (IEC 61558-2-8:2024); German version EN IEC 61558-2-8:2025
IEC 32C/283A/CDV
Miniature fuses - Part 4: Universal Modular Fuse-links (UMF) (IEC 60127-4:1996 + A1:2002 + A2:2003)
IEC 47A/730/CD
Integrated circuits - Measurement of impulse immunity - Part 2: Fast Impulse Injection method (IEC 47A/730/CD:2005)
