Thermal standardization on semiconductor packaging - Part 3: Thermal circuit simulation models of semiconductor packages for transient analysis

Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

Model creation method using a datasheet of semiconductor device

Standard interface for connecting charging stations to local energy management systems - Part 2: Specific data model mapping (IEC 63380-2:2025); German version EN IEC 63380-2:2025

Standard interface for connecting charging stations to local energy management systems - Part 3: Communication protocol and cybersecurity specific aspects (IEC 63380-3:2025); German version EN IEC 63380-3:2025

Management of Distributed Energy Storage Systems based on Electrically Chargeable Vehicles (ECV-DESS) - Part 1: Definitions, Requirements and Use Cases (IEC 69/941/CDV:2024); German and English version prEN IEC 63382-1:2024

Hybrid CPV/PV modules: General characteristics and measurement procedures - Part 1: Performance measurements and power rating - Irradiance and temperature

Sustainable management of waste electrical and electronic equipment (e-waste) (IEC 111/750/CDV:2024); German and English version prEN IEC 63395:2024

Household and similar electrical rice cookers - Methods for measuring the performance (IEC 59L/244/CDV:2023); German and English version prEN IEC 63399:2023