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DIN EN IEC 63563-5
Qi Specification version 2.0 - Part 5: Communications Physical Layer
DIN EN IEC 63563-6
Qi Specification version 2.0 - Part 6: Communications Protocol
DIN EN IEC 63563-7
Qi Specification version 2.0 - Part 7: Foreign Object Detection
DIN EN IEC 63563-8
Qi Specification version 2.0 - Part 8: NFC Tag Protection
DIN EN IEC 63563-9
Qi Specification version 2.0 - Part 9: Authentication Protocol
DIN EN IEC 63563-10
Qi Specification version 2.0 - Part 10: MPP System Specification
DIN EN IEC 63563-11
Qi Specification version 2.0 - Part 11: MPP Communications Protocol
DIN EN IEC 63567-1
Semiconductor devices Performance evaluation of semiconductor components and equipment - Part 1: Transmittance evaluation method of EUV pellicle
DIN EN IEC 63567-3
Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 3: Nano-scale wafer surface inspection method using UV light
DIN EN IEC 63567-4
Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 4: Evaluation methods for dimensional accuracy of laser dicing process
