Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 47/2861/CDV:2024); German and English version prEN IEC 60749-7:2024

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2862/CDV:2024); German and English version prEN IEC 60749-21:2024

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 47/2881/CDV:2024); German and English version prEN IEC 60749-23:2024

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 47/2863/CDV:2024); German and English version prEN IEC 60749-24:2024

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 47/2882/CDV:2024); German and English version prEN IEC 60749-26:2024

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test