Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2862/CDV:2024); German and English version prEN IEC 60749-21:2024

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods (IEC 60749-22-1:2025); German version EN IEC 60749-22-1:2026

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods (IEC 60749-22-2:2025); German version EN IEC 60749-22-2:2026

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 47/2881/CDV:2024); German and English version prEN IEC 60749-23:2024

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 47/2863/CDV:2024); German and English version prEN IEC 60749-24:2024

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2025); German version EN IEC 60749-26:2026

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

Optical fibres - Part 1-20: Measurement methods and test procedures - Fibre geometry

Optical fibres - Part 1-21: Measurement methods and test procedures - Coating geometry