Thermistors - Directly heated positive step-function temperature coefficient - Part 1-2: Blank detail specification - Heating element application - Assessment level EZ

Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ

Thermistors - Directly heated positive step-function temperature coefficient - Part 1-4: Blank detail specification - Sensing application - Assessment level EZ

Semiconductor devices - Part 14-13: Semiconductor sensors - Performance test methods for spectral sensors

Semiconductor devices - Part 16-11: Microwave integrated circuits - Detectors

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 47/2861/CDV:2024); German and English version prEN IEC 60749-7:2024

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2862/CDV:2024); German and English version prEN IEC 60749-21:2024

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods (IEC 60749-22-1:2025); German version EN IEC 60749-22-1:2026