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DIN EN IEC 60743/A1
Live working - Terminology for tools, devices and equipment
DIN EN IEC 60747-16-9
Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 47E/768/CD:2021); Text in German and English
DIN EN IEC 60747-16-11
Semiconductor devices - Part 16-11: Microwave integrated circuits - Detectors
DIN EN IEC 60747-17
Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
DIN EN IEC 60749-7
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 47/2861/CDV:2024); German and English version prEN IEC 60749-7:2024
DIN EN IEC 60749-20-1
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
DIN EN IEC 60749-21
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2862/CDV:2024); German and English version prEN IEC 60749-21:2024
DIN EN IEC 60749-22-1
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods
DIN EN IEC 60749-22-2
Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
DIN EN IEC 60749-23
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 47/2881/CDV:2024); German and English version prEN IEC 60749-23:2024
