Search results
Search list
Results in:
IPC D-859
Design Standard for Thick Film Multilayer Hybrid Circuits
Edition
1989-12-01
IPC TF-870
Qualification and Performance of Polymer Thick Film Printed Boards
Edition
1989-11
OVE EN IEC 61189-2-809
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1800/CDV) (english version)
Edition
2022-09-15
ABNT NBR ISO 4382-1
Plain bearings - Copper alloys Part 1: Cast copper alloys for solid and multilayer thick-walled plain bearings
Edition
2022-11-09
ABNT NBR 8300
Heavy thick carbon steel plates for general use - Requirements
Edition
2016-11-16
PR NF C93-732-809 ; PR NF EN IEC 61189-2-809
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809 : X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
PR NF T70-522
Energetic materials for defense - Safety, vulnerability - Technical data document of the 3 l high explosive generic hardware with a thick metallic wall
15/30315504 DC
BS ISO 4586-3. High-pressure decorative laminates (HPL, HPDL). Sheets based on thermosetting resins (Usually called Laminates). Part 3. Classification and specifications for laminates less than 2 mm thick and intended for bonding to supporting substrates
Edition
2015-03-12
15/30315510 DC
BS ISO 4586-5. High-pressure decorative laminates (HPL, HPDL). Sheets based on thermosetting resins (Usually called Laminates). Part 5. Classification and specifications for flooring grade laminates less than 2 mm thick intended for bonding to supporting substrates
Edition
2015-03-12
17/30355236 DC
BS ISO 4586-3. High-pressure decorative laminates (HPL, HPDL). Sheets based on thermosetting resins (Usually called Laminates). Part 3. Classification and specifications for laminates less than 2 mm thick and intended for bonding to supporting substrates
Edition
2017-02-21