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DIN EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
Edition
2016-12
DIN EN 62137-4
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
Edition
2015-07
DIN 51175
Vitreous and porcelain enamels - Determination of thermomechanical properties
Edition
2021-03
DIN EN 820-2
Advanced technical ceramics - Methods of test for monolithic ceramics - Thermo-mechanical properties - Part 2: Determination of self-loaded deformation; German version EN 820-2:2003
Edition
2003-07
DIN EN 820-1
Advanced technical ceramics - Methods of testing monolithic ceramics; Thermo-mechanical properties - Part 1: Determination of flexural strength at elevated temperatures; German version EN 820-1:2002
Edition
2003-01
DIN IEC/TS 63397 ; VDE V 0126-41:2025-12
Photovoltaic (PV) modules - Qualifying guidelines for increased hail resistance (IEC TS 63397:2022 + COR1:2023)
Edition
2025-12
DIN EN ISO 9693
Dentistry - Compatibility testing for metal-ceramic and ceramic-ceramic systems (ISO 9693:2019); German version EN ISO 9693:2019
Edition
2020-02
DIN VDE 0278-629-3 ; VDE 0278-629-3:2025-02
Test requirements for accessories for use on power cables of rated voltage from 3,6/6(7,2) kV up to 20,8/36(42) kV - Part 3: Transition joints between cables with impregnated paper insulation and cables with extruded insulation; German version HD 629.3 S1:2024
Edition
2025-02
DIN EN 1770
Products and systems for the protection and repair of concrete structures - Test methods - Determination of the coefficient of thermal expansion; German version EN 1770:1998
Edition
1998-04
DIN EN IEC 61189-2-803
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023
Edition
2024-08