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DIN Standards Committee for Organizational Processes

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Standards [Pre-order]

DIN EN IEC 61189-3-302
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 61189-3-302:2025); German version EN IEC 61189-3-302:2025

Title (German)

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-302: Computertomographisches Verfahren (CT) zur Detektion von Metallisierungsfehlern in unbestückten Leiterplatten (IEC 61189-3-302:2025); Deutsche Fassung EN IEC 61189-3-302:2025

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Edition 2026-08
Original language German
Price from 105.20 €
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Table of contents

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