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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60191-6-8 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 60191-3 | 2000-07 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999 More |
| DIN EN 60191-6-3 | 2001-06 | Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000 More |
| DIN EN 60191-6-5 | 2002-05 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001 More |
| DIN EN 60191-6-6 | 2002-02 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001 More |
| IEC 60191-2 | 1966 | Mechanical standardization of semiconductor devices. Part 2 : Dimensions More |
| IEC 60191-2 AMD 1 | 2001-03 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 1 More |
| IEC 60191-2 AMD 2 | 2001-06 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 2 More |
| IEC 60191-2 AMD 3 | 2001-08 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 3 More |
| IEC 60191-2 AMD 4 | 2001-11 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 4 More |
| IEC 60191-2 AMD 5 | 2002-02 | Mechanical standardization of semiconductor devices - Part 2: Dimensions More |
