NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 62025-2 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61190-1-3 | 2017-12 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non- fluxed solid solder for electronic soldering applications More |
| DIN EN IEC 61190-1-3 | 2018-09 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018 More |
| DIN EN 60068-1 ; VDE 0468-1:2015-09 | 2015-09 | Environmental testing - Part 1: General and guidance (IEC 60068-1:2013); German version EN 60068-1:2014 More |
| DIN EN 60068-2-27 ; VDE 0468-2-27:2010-02 | 2010-02 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock (IEC 60068-2-27:2008); German version EN 60068-2-27:2009 More |
| DIN EN 60068-2-45 | 1994-02 | Basic environmental testing procedures; part 2: tests; test XA and guidance: immersion in cleaning solvents (IEC 60068-2-45:1980 + A1:1993); German version EN 60068-2-45:1992 + A1:1993 More |
| DIN EN 60068-2-6 ; VDE 0468-2-6:2008-10 | 2008-10 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) (IEC 60068-2-6:2007); German version EN 60068-2-6:2008 More |
| DIN EN 60068-2-69 ; VDE 0468-2-69:2020-03 | 2020-03 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017 + COR1:2018 + A1:2019); German version EN 60068-2-69:2017 + AC:2018 + A1:2019 More |
| DIN EN 60068-2-77 | 1999-10 | Environmental testing - Part 2-77: Tests; test 77: Body strength and impact shock (IEC 60068-2-77:1999); German version EN 60068-2-77:1999 More |
| DIN EN 61188-5-2 | 2004-05 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003 More |
| DIN EN 61190-1-2 | 2014-11 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014 More |
