NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62149-9 ; VDE 0886-149-9:2015-01 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| ITU-T G.691 | 2006-03 | Optical interfaces for single channel STM-64 and other SDH systems with optical amplifiers More |
| ITU-T G.698.3 | 2012-02 | Multichannel seeded DWDM applications with single-channel optical interfaces More |
| IEC 60068-2-27 | 2008-02 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock More |
| IEC 60068-2-6 | 2007-12 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) More |
| IEC 60068-2-78 | 2012-10 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state More |
| IEC 60749-25 | 2003-07 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling More |
| DIN EN 60068-2-27 ; VDE 0468-2-27:2010-02 | 2010-02 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock (IEC 60068-2-27:2008); German version EN 60068-2-27:2009 More |
| DIN EN 60068-2-6 ; VDE 0468-2-6:2008-10 | 2008-10 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) (IEC 60068-2-6:2007); German version EN 60068-2-6:2008 More |
| DIN EN 60191-3 | 2000-07 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999 More |
| DIN EN 60191-3 Beiblatt 1 | 2006-08 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms More |
