NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60749-30 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-20 | 2008-12 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 60749-25 | 2003-07 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling More |
| IEC 60749-11 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
| IEC 60749-24 | 2005-11 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST More |
| IEC 60749-33 | 2005-11 | Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave More |
| IEC 60749-4 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) More |
| IEC 60749-5 | 2003-01 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test More |
