NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Micro-electromechanical devices - Part 54: Silicon based MEMS fabrication technology - Test method of microstructure tensile

Abstract

This part of IEC 62047 specifies the requirements and testing method to measure the tensile strength of microstructures which are fabricated by micromachining technology used in silicon based micro-electromechanical system (MEMS). This document is applicable to the in-situ tensile strength measurement of microstructures manufactured by microelectronic technology process and other micromachining technology.

Begin

2026-07-09

Planned document number

DIN EN IEC 62047-54

Project number

02233993

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Contact

Denis Kasalo

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-149

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