DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Information technology - Telecommunications bonding networks for buildings and other structures (ISO/IEC 30129:2015/AMD2:2025)
Abstract
This document specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information or telecommunications technology equipment is intended to be installed in order to a) minimise the d.c. and a.c. potential differences in order to reduce the risk of malfunction of that equipment and interconnecting cabling due to electromagnetic disturbance, b) provide the telecommunications installation with a reliable signal reference – which may improve immunity from electromagnetic interference (EMI).
Begin
2023-07-25
Planned document number
DIN ISO/IEC 30129/A2
Project number
02231740
Responsible national committee
draft standard
Information technology - Telecommunications bonding networks for buildings and other structures (ISO/IEC 30129:2015/AMD2:2025)
2025-11
Order from DIN Media
