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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Project

IEC 62047-13 Ed.1: SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures

Begin

2009-07-03

Planned document number

IEC 47F/72/CDV

Responsible national committee

DKE/K 631 - Halbleiterbauelemente

Responsible international committee

IEC/SC 47F - Micro-electromechanical systems

Contact

Elena Rongen

Merianstraße 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

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Economic benefits

DIN SPEC

Why do standards cost money?

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Terminology