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Publications of IEC/SC 47D

DIN EN 60191-3 2000-07 Standards Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999 More  Order from DIN Media
DIN EN 60191-6-1 2002-08 Standards Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001 More  Order from DIN Media
DIN EN 60191-6-2 2002-09 Standards Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002 More  Order from DIN Media
DIN EN 60191-6-3 2001-06 Standards Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000 More  Order from DIN Media
DIN EN 60191-6-4 2004-01 Standards Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003 More  Order from DIN Media
DIN EN 60191-6-8 2002-05 Standards Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001 More  Order from DIN Media
DIN EN 60191-6-10 2004-05 Standards Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003 More  Order from DIN Media
DIN EN 60191-6-16 2007-11 Standards Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007 More  Order from DIN Media

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