Projekt
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (Future IEC 62047-11)
Beginn
2008-08-22
Geplante Dokumentnummer
IEC 47F/5/NP
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
