Projekt
(Future IEC 62047-17): Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Beginn
2010-02-26
Geplante Dokumentnummer
IEC 47F/46/NP
Zuständiges nationales Arbeitsgremium
DKE/K 631 - Halbleiterbauelemente
