Projekt
(Future IEC 61249-2-39): Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - Modified epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Beginn
2008-03-07
Geplante Dokumentnummer
IEC 91/756/NP
Zuständiges nationales Arbeitsgremium
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
