Project
EMC IC modelling - Part 4-1: Use of ICIM-CI model to predict the IC conducted immunity in a PCB
Abstract
This part of IEC 62433-4 provides an overview of good practices to extract an ICIM-CI model from measurements and to build a numerical model of the PCB in which the ICIM -CI model is used to predict RF immunity of an IC in its application PCB. This document also discusses factors which can be considered to obtain proper results in an ICIM-CI model extraction and use of the actual model at the PCB level.
Begin
2025-08-20
Planned document number
DIN IEC/TR 62433-4-1
Project number
02233355
