Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Abstract
This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass – fail purposes. NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using 199 solder bath and solder globule method.
Begin
2023-11-28
Planned document number
DIN EN IEC 60068-2-83
Project number
02231951
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
