Project
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
Abstract
This part of IEC 60749 describes a test method used to determine the resistance of power semiconductor modules to thermal and mechanical stresses resultant from cycling the power dissipation of the internal semiconductor module and internal connectors. It is based on IEC 60749-34, Power cycling, but is developed specifically for silicon based power semiconductor module products. This test causes wear-out and is considered destructive.
Begin
2022-05-03
Planned document number
DIN EN IEC 60749-34-1
Project number
02230993
