Attention: Your browser doesn't support javascript or you have deactivated Javascript in your browser. Please enable Javascript in your browser in order to be able to use all functions of this website.

Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information
Smart Farming Standards and specifications are drivers for the digitalization of agriculture
More information

Draft standard [New]

DIN EN IEC 61189-3-302
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024

Title (German)

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-302: Erkennung von Beschichtungsfehlern in unbestückten Leiterplatten durch Computertomographie (CT) (IEC 91/1973/CDV:2024); Deutsche und Englische Fassung prEN IEC 61189-3-302:2024

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Edition 2025-11

Publication 2025-10-31

Public enquiry period until 2025-12-31

Original language German , English

Price from 109.50 €

Read draft and comment Order from DIN Media

Table of contents

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-418

Send message to contact

Economic benefits

DIN SPEC

Why do standards cost money?

Get involved in standardization

Terminology

Hydrogen Technologies Standards form the basic framework for market ramp-up

Climate change Standards and specifications support climate targets

Smart Farming Standards and specifications are drivers for the digitalization of agriculture

Responsible national committee

Daniel Failer

Want to learn more?