DIN EN IEC 61967-8
; VDE 0847-21-8:2024-10
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method (IEC 61967-8:2023); German version EN IEC 61967-8:2023
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8: Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren (IEC 61967-8:2023); Deutsche Fassung EN IEC 61967-8:2023
Overview
The measurement procedure describes a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This test method is based on the TEM wave guide measurement principle according to IEC 61000-4-20. The intent of this test method is to provide a quantitative measure of the RF emissions from ICs for comparison or other purposes. There are no restrictions on the scope of application of the document. The IC stripline offers a broadband method of measuring either immunity of a DUT to fields generated within the IC Stripline or radiated emission from a DUT placed within the IC Stripline.
