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Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English

Dental Data for Exchange

Dental Data for Exchange

Resin based reactive compounds used for electrical insulation - Part 3-8: Specifications for individual materials - Resins for cable accessories

Dependability management - Part 3-17: Application guide - Availability (IEC 56/1850/CD:2019); Text in German and English

Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices

Model creation method using a datasheet of semiconductor device

Method for measuring technically necessary manual actuating forces

Electromagnetic compatibility (EMC) - Part 4-7: Testing and measurement techniques - General guide on harmonics and interharmonics measurements and instrumentation, for power supply systems and equipment connected thereto (IEC 77A/1230/CD:2024)

EMC IC modelling - Part 4-1: Use of ICIM-CI model to predict the IC conducted immunity in a PCB

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