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Committees

IEC/TC 91

Electronics assembly technology

Committees

DKE/K 682

Aufbau- und Verbindungstechnik für elektronische Baugruppen

Polyolefin pipe fitting assemblies

Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant

Amendment 2 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures

Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units

Environmental testing - Part 2-88: Tests - Test XD: Resistance of components and assemblies to liquid cleaning media (IEC 60068-2-88:2025); German version EN IEC 60068-2-88:2025

IEC 62218, Ed.1: Test 5E02: Surface insulation resistance, assemblies

Rolling bearings - Roller blocks as subassemblies for linear motion rolling bearings - Boundary dimensions and tolerance values

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

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