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DIN EN IEC 61191-10-2
Printed board assemblies - Part 10-2: Guideline for the Output Profile Design in Laser-Assisted Bonding
DIN EN 50310 Beiblatt 1
Telecommunications bonding networks for buildings and other structures; Supplement 1: Assessment of equipotential bonding for information technology equipment in existing installations
VG 95376-6 Bbl 1
Electromagnetic Compatibility - Fundamentals and Measures for the Development and Design of Equipment - Part 6: Bonding, impedances of bonding connections; text in German and English
DIN EN IEC 60749-22-2
Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
prEN ISO 21368-1
Adhesives - Guidelines for the fabrication of adhesively bonded structures - Part 1: General requirements
prEN 12697-12 rev
Bituminous mixtures - Test methods - Part 12: Determination of the water sensitivity of bituminous specimens
DIN EN 12697-12 rev
Bituminous mixtures - Test methods - Part 12: Determination of the water sensitivity of bituminous specimens
VG 96927-9
Electrical cable assemblies - Part 9: Bonding straps, detail specification
DIN CEN/TR EC108034
Methods of determination of the mechanical properties of self-bonding coating assemblies related to non-oriented electrical steels
NA 087-00-12-01 UA
Ahesive bonding
