Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 61188-6-3:2024); German version EN IEC 61188-6-3:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 61189-3-302:2025); German version EN IEC 61189-3-302:2025

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Printed board assemblies - Part 10-2: Guideline for the Output Profile Design in Laser-Assisted Bonding

Mineral insulating oils - Methods for the determination of 2-furfural and related compounds

Fibre optic interconnecting devices and passive components - Fibre optic isolators - Part 1: Generic specification (IEC 86B/5192/CDV:2026); German and English version prEN IEC 61202-1:2026

Synthetic organic esters - Guidelines for maintenance and use in electrical equipment (IEC 61203:2025); German version EN IEC 61203:2025