Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan (IEC/TS 62647-1:2012)
Edition 2013-07

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012)
Edition 2013-09

Blank Detail Specification: Fixed low power wirewound surface mount (SMD) resistors; German version EN 140402:2015 + A1:2016
Edition 2017-07

Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2; German version EN 140402-801:2015
Edition 2015-12

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010); German version EN 61191-6:2010
Edition 2011-01

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
Edition 2022-04

Terms and definitions of nuclear technology, only on CD-ROM
Edition 2015-04

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
Edition 2018-09

Detail Specification: Fixed low power film high stability SMD resistors - Rectangular - Stability classes 0,1; 0,25; German version EN 140401-804:2011 + A1:2013 + A2:2019
Edition 2019-11

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002
Edition 2003-01